HOT MELT ADHESION POLYIMIDE FILM
Application area
Product applications can be divided into three categories according to the
characteristics of the adhesive layer thermoplastic PI glue:A series: The pressing temperature is 400-430°C, the highest temperature.-Generally used as an ultra-high temperature label application.T series, the pressing temperature is 320-330°C, and it is used in long-termrepeated work scenarios above 260°C (high temperature heating tablets,electronic cigarette heating components, etc.).M series,the pressing temperature is 210-220°C,and it is used for encapsula-
tion and insulation of FPC/CCS cables,busbars,heating plates,etc.

Product features
Thermoplastic PI glue is a polyimide resin, which is more resistant to hightemperature than epoxy resin glue on the market.The thickness can becustomized according to customer requirements.