HOT MELT ADHESION POLYIMIDE FILM

HOT MELT ADHESION POLYIMIDE FILM

Application area

Product applications can be divided into three categories according to the
characteristics of the adhesive layer thermoplastic PI glue:A series: The pressing temperature is 400-430°C, the highest temperature.-Generally used as an ultra-high temperature label application.T series, the pressing temperature is 320-330°C, and it is used in long-termrepeated work scenarios above 260°C (high temperature heating tablets,electronic cigarette heating components, etc.).M series,the pressing temperature is 210-220°C,and it is used for encapsula-
tion and insulation of FPC/CCS cables,busbars,heating plates,etc.

Product features

Thermoplastic PI glue is a polyimide resin, which is more resistant to hightemperature than epoxy resin glue on the market.The thickness can becustomized according to customer requirements.