PI COMPOSITEMETAL FOIL

PI COMPOSITEMETAL FOIL

PI COMPOSITEMETAL FOIL

It is a type of material composed of polyimide and various metal foils. It combines the characteristics of metal foil and polyimide film. It has high binding force (peeling force), high temperature resistance, puncture resistance, conductive shielding, heat dissipation and insulation.

Product Details

Product description

It is a type of material composed of polyimide and various metal foils. It combines the characteristics of metal foil and polyimide film. It has high binding force (peeling force), high temperature resistance, puncture resistance, conductive shielding, heat dissipation and insulation.

Product structure

  • Metal Foil
  • PI

Metal foil: aluminum foil, copper foil, copper aluminum foil, Ivan foil, Kang copper foil, alloy foil, etc., and the metallized film is coated with PI.

Product features

According to the different functions of PI coatings, they are divided into two categories
1), Polyimide metal composite foil
Coated with a layer of PI, it combines the characteristics of PI’s high insulation, flexibility, lightness, high temperature resistance, and metal shielding and heat dissipation.
2), Polyimide metal bonding foil
Coated with a layer of PI, it has the function of insulating hot melt bonding and has a high temperature resistance of more than 200℃.

Product thickness and color can be customized:
1), polyimide metal composite foil PI coating thickness 5-25um, metal foil thickness ≥ 20um
2), polyimide metal bonded foil: PI coating thickness 5-12um, the thickness of the metal foil is ≥10um

Application area

Printed circuit boards, flexible displays, wearable devices, aerospace, medical and other applications.

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