We has developed MPI, a low-dielectric and low-loss polyimide film that overcomes the performance limitations of traditional PI in high-frequency signal transmission. It is a key material for high-end electronic fields such as 5G communication and high-frequency circuit boards.
We has developed MPI, a low-dielectric and low-loss polyimide film that overcomes the performance limitations of traditional PI in high-frequency signal transmission. It is a key material for high-end electronic fields such as 5G communication and high-frequency circuit boards.
Thickness: 25-150μm, Width: 520mm
Dk: 3.0 (at 10GHz), Df: 0.002 (at 10GHz)
Used in various high-frequency communication antennas in 5G/6G communications, semiconductor packaging, robotics, drones, electric vehicles, and low-altitude aircraft.
