Product applications can be divided into three categories according to the characteristics of the adhesive layer thermoplastic PI glue:
A series: The pressing temperature is 400-430°C, the highest temperature.- Generally used as an ultra-high temperature label application.
T series, the pressing temperature is 320-330°C, and it is used in long-term repeated work scenarios above 260°C (high temperature heating tablets, electronic cigarette heating components, etc.).
M series,the pressing temperature is 210-220°C,and it is used for encapsulation and insulation of FPC/CCS cables,busbars,heating plates,etc.
Thermoplastic PI glue is a polyimide resin, which is more resistant to high temperature than epoxy resin glue on the market.The thickness can be customized according to customer requirements
| ITEM | UNIT | A | T | M | CBDF |
|---|---|---|---|---|---|
| Thermosetting PI thickness | um | 25-100 | / | ||
| Thermoplastic PI thickness | um | Customizable,thickness range 5-20um | 13/25um | ||
| Glued surface | / | Single side | Single side | Single side | Pure film |
| width | mm | 500 | 500 | 500 | 520 |
| Pressing conditions | 400-430 °C/5min,pressure12kgf/cm² | 320-330 °C/5min,pressure12kgf/cm² | 210-220 °C/5min,pressure12kgf/cm² | 320-330 °C/5min,pressure12kgf/cm² |
